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Gerhard Heiming

Hensoldt and Nano Dimension have recently reported a significant breakthrough in the use of 3D printing for the development of high-performance electronic components by utilising a newly developed dielectric polymer ink and conductive ink from Nano Dimension, with which Hensoldt has produced the world’s first ten-layer printed circuit board with high-performance electronic structures soldered on both sides. Until now, 3D printed boards could not withstand the soldering process necessary for two sided population of components, but the Additively Manufactured Electronics (AME) process is very useful when it comes to testing a new design and new functions of special electronic components before series production. With this process, prototypes for new electronic circuits can be produced flexibly and individually. Additive manufacturing (3D printing) can increase the compactness and reliability of electronic components and printed electronics.

 

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