Print Friendly, PDF & Email

Italy’s ELT Group has been selected to be involved in nine projects under the Work Programme 2022 of the European Defence Fund (EDF), the company announced on 25 July 2023.

The projects selected this year include research and development (R&D) activities in the air, naval, land, cyber and space domains, in which the company will contribute its expertise across electromagnetic spectrum operations (EMSO) and the cyber field.

In the air domain ELT Group will be involved in the Responsive Electronic Attack for Cooperation Tasks II (REACT II) project for an airborne electronic attack capability as a follow-on to work conducted under the European Defence Industrial Development Programs 2019 initiatives, as well as in the Future Air System for European Tactical Transportation (FASETT) project studying a new transport aircraft for EU member states.

In the naval domain the company will be involved with the EU NAval Collaborative Surveillance Operational Standard (E-NACSOS) project for naval surveillance and the EUROpean Goal based mUlti mission Autonomous naval Reference platform Development (EUROGUARD) project, which will integrate innovative EU technologies into a demonstrator vessel for coastal operations.

Regarding the terrestrial domain, ELT Group will work on the LAnd TActical Collaborative Combat (LATACC) project to strengthen the collaborative capability between command posts, vehicles, soldiers and unmanned assets in high-intensity conflicts.

In the space domain ELT Group will be involved with the Space based Persistent ISR for Defence and Europe Reinforcement (SPIDER) project for a constellation of military intelligence/surveillance/reconnaissance (ISR) satellites that will include signals intelligence payloads, while in the cyber domain the company will work on the NEWSROOM project aimed at overcoming the current limitations of cyber situational awareness (CSA).

Finally, in the technological domain, ELT Group will work on the Technology Innovation for Radar European SYstem ApplicationS (TIRESYAS), which looks to counter emerging threats by increasing the resilience of sensors, and the European Packaging for highly Integrated Circuits for Reliable Electronics (EPICURE) project, which looks to outsource semiconductor assembly and testing and support technology providers in Europe in the field of advanced packaging for defence needs.

Peter Felstead